ASMPT, a global leader in semiconductor and electronics manufacturing, has developed innovative assembly technology to meet the high demands of the rapidly evolving Artificial Intelligence industry. This technology allows for the precise placement of extremely small components, such as the 0201-m components, ensuring high accuracy and flexibility in assembly. With the ability to handle large and heavy BGA chips, as well as an increasing number of connections, ASMPT’s assembly technology provides a reliable solution for the production of advanced AI processors.
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SIPLACE Technology Enables Precision Assembly of Ultra-Small Components
The SIPLACE assembly technology is designed to handle the placement of modern 0201-m components that are smaller than a human hair. These tiny components require precise and tight placement on the circuit board, and the SIPLACE machines achieve this by individually measuring and compensating for any offset in the pick-up position using rotating segments on the placement head. This results in the highest level of accuracy in component placement, allowing for flexibility in achieving any desired placement angle.
SIPLACE Bestückautomaten ermöglichen reibungslosen Transport von schweren BGAs
To meet the increasing computational demands of modern AI applications, processors have become larger and more complex. The SIPLACE assembly machines address the challenge of handling heavy Ball Grid Arrays (BGAs) by precisely measuring their moment of inertia using defined rotational movements. This ensures that the components are transported with maximum acceleration, eliminating any disturbances caused by inertia.
SIPLACE Bestückautomaten ermöglichen fehlerfreie Bestückung von KI-Prozessoren mit Tausenden von Kontakten
The increasing complexity of modern AI processors necessitates a large number of contacts, which will soon reach the tens of thousands. SIPLACE assembly machines have the capability to automatically read the arrangement of these contact points or import the manufacturer’s geometrical data. This ensures a flawless assembly process and eliminates the risk of errors.
Advanced 3D Height Profiling Enables Precise Inspection of BGAs
The visual inspection of components using a built-in camera is crucial for large-scale Ball Grid Arrays (BGAs). To ensure accuracy, SIPLACE assembly machines are equipped with a 3D coplanarity module that accurately measures the 3D height profile of the components. This enables the machines to perform highly precise coplanarity checks, ensuring that the components are properly aligned and mounted.
High-resolution camera enables precise inspection of component placement on PCBs
The SIPLACE assembly machines utilize a high-resolution circuit board camera to inspect the component placement position on the PCB. This enables the detection and examination of spacer elements that are crucial for ensuring a smooth reflow soldering process.
Cost-Effective Precision Assembly for High-End AI Processors
The precise assembly effort pays off, as the prices for state-of-the-art AI processors can be very high. ASMPT’s innovative assembly technologies provide a solution for the challenges of Artificial Intelligence. Through automated measurement, intelligent vision systems, and adaptive assembly mechanisms, flawless assembly is enabled. Electronics manufacturers are well equipped to meet the increasing demands of electronic products.
ASMPT’s Innovative Assembly Technologies Provide Solutions for AI Challenges
ASMPT’s innovative assembly technologies provide a solution to the challenges of Artificial Intelligence. By incorporating automated measurement, intelligent vision systems, and adaptive assembly mechanisms, ASMPT ensures error-free assembly. This advanced technology equips electronics manufacturers to meet the increasing demands of electronic products accurately and efficiently.
